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ProductLow Particle Packing Material: Clean Pack
In order to provide clean environment in transfer and transport as has the same level with that in production for silicon wafer, we have developed two kinds of clean packs with different compositions to meet different needs of customers.
Feature
1. The manufacturing process is under control entirely.
2. Raw materials are selected strictly, which prevents the mixing of dust and metal ion into materials to the greatest extent.
3. Three-dimensional pouches, three-sided pouches and other types of pouches are available.
Application
・Silicon/compound wafer; mask ・Electronic materials and parts ・Special resin, powder, etc. |
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Specification
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